ECCN 3E993
RSATTechnology for the development or production of commodities specified in 3B993; and technology as follows .
Items Covered
- a."Technology" specially designed for the "development" or "production" of commodities specified by 3B993.
- b."Technology" designed or modified to increase the number of wafers processed per hour, averaged over any time interval, by greater than 1%, of equipment specified in 3B001.f.1 or 3B993.f.1.
- c."Technology" not specified by 3E993.a designed or modified to perform all of the following in or with deep-ultraviolet immersion photolithography equipment:
- 1. Decrease the minimum resolvable feature specified by 3B993.f.1.b.1; and
- 2. Decrease the maximum 'dedicated chuck overlay' of a deep-ultraviolet immersion lithography equipment above 1.5 nm and below or equal to 2.4 nm.
Control Reasons
RSRegional Stability
Items controlled for regional stability reasons.
Column 1: YesColumn 2: No
ATAnti-Terrorism
Items controlled for anti-terrorism reasons. Most items on the CCL have AT controls.
Column 1: YesColumn 2: No
Disclaimer
This information is for reference only. For official classifications, consult BIS or a qualified export control professional.