ECCN 3B903
NSRSATScanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices or integrated circuits, having all of the following .
What This ECCN Covers
ECCN 3B903 controls Scanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices, meeting the entry's criteria. SEM tools used in chip inspection and failure analysis support advanced semiconductor work and are controlled for National Security, Regional Stability, and Anti-Terrorism reasons.
Who needs to check this?
Suppliers of SEM and electron-beam inspection equipment for semiconductor metrology, defect review, and failure analysis.
Compliance tip
Control turns on the SEM being designed for semiconductor-device imaging with the characteristics in the entry — general-purpose microscopes may fall outside. The RS reason ties into advanced-semiconductor policy; verify the Country Chart and treat advanced-node applications with added diligence.
Items Covered
- a.Stage placement accuracy less (better) than 30 nm;
- b.Stage positioning measurement performed using laser interferometry;
- c.Position calibration within a field-of-view (FOV) based on laser interferometer length-scale measurement;
- d.Collection and storage of images having more than 2 x 108 pixels;
- e.FOV overlap of less than 5 percent in vertical and horizontal directions;
- f.Stitching overlap of FOV less than 50 nm; and
- g.Accelerating voltage more than 21 kV.
Control Reasons
Items controlled for national security reasons under multilateral export control regimes.
Items controlled for regional stability reasons.
Items controlled for anti-terrorism reasons. Most items on the CCL have AT controls.
Disclaimer
This information is for reference only. For official classifications, consult BIS or a qualified export control professional.