ECCN 2B005
NSATEquipment specially designed for the deposition, processing and in-process control of inorganic overlays, coatings and surface modifications, as follows, for substrates specified in column 2, by processes shown in column 1 in the Materials Processing Table; Deposition Techniques following 2E003.f , and specially designed automated handling, positioning, manipulation and control components therefor.
What This ECCN Covers
ECCN 2B005 controls equipment specially designed for the deposition, processing, and in-process control of inorganic overlays, coatings, and surface modifications — for example chemical vapor deposition, physical vapor deposition, plasma spraying, and related coating systems meeting the entry's criteria. This coating equipment supports turbine and other high-performance components and is controlled for National Security and Anti-Terrorism reasons.
Who needs to check this?
Makers and exporters of CVD/PVD, plasma-spray, and ion-plating coating systems, and the in-process control equipment used with them.
Compliance tip
Control follows the specific coating process and capability described in the entry — match your system to the listed process category. Confirm the NS and AT columns; coating technology and the coated materials may be controlled under separate Category 2 and Category 1 entries.
Items Covered
- 1. A process modified for one of the following:
- 1.a. Pulsating CVD;
- 1.b. Controlled nucleation thermal deposition (CNTD); or
- 1.c. Plasma enhanced or plasma assisted CVD; and
- 2. Having any of the following:
- 2.a. Incorporating high vacuum (equal to or less than 0.01 Pa) rotating seals; or
- 2.b. Incorporating in situ coating thickness control;
- b.Ion implantation "production equipment" having beam currents of 5 mA or more;
- c.Electron beam physical vapor deposition (EB-PVD) "production equipment" incorporating power systems rated for over 80 kW and having any of the following:
- 1. A liquid pool level "laser" control system which regulates precisely the ingots feed rate; or
- 2. A computer controlled rate monitor operating on the principle of photo-luminescence of the ionized atoms in the evaporant stream to control the deposition rate of a coating containing two or more elements;
- d.Plasma spraying "production equipment" having any of the following:
- 1. Operating at reduced pressure controlled atmosphere (equal or less than 10 kPa measured above and within 300 mm of the gun nozzle exit) in a vacuum chamber capable of evacuation down to 0.01 Pa prior to the spraying process; or
- 2. Incorporating in situ coating thickness control;
- e.Sputter deposition "production equipment" capable of current densities of 0.1 mA/mm2 or higher at a deposition rate 15 µm/h or more;
- f.Cathodic arc deposition "production equipment" incorporating a grid of electromagnets for steering control of the arc spot on the cathode;
- g.Ion plating "production equipment" capable of in situ measurement of any of the following:
- 1. Coating thickness on the substrate and rate control; or
- 2. Optical characteristics.
Control Reasons
Items controlled for national security reasons under multilateral export control regimes.
Items controlled for anti-terrorism reasons. Most items on the CCL have AT controls.
Disclaimer
This information is for reference only. For official classifications, consult BIS or a qualified export control professional.